To raise the capacitance and electric noise resistance enough and suppress the leak current a multilayer chip electronic component by forming an insulation compsn. layer contg. a ferrite as a main component on the outer surface thereof.

The multilayer chip electronic component 10 has mutually parallel inner electrodes 12 which are formed in a dielectric ceramic molding 11 and alternately connected to outer electrodes 13 formed at the right and left side faces of the molding 11. The outer electrodes 3 extend to the ends of the faces adjacent the both side faces of the molding 11 so as to be difficult to peel off from these side faces and other outer surface is covered with an insulation compsn. layer 14 than the part occupied by the outer electrodes 13. This layer 14 is composed of a ferrite X-Fe2O4 (X is at least one of Zn, Ni and Cu) and glass contg. at least one of Bi, Co, Si and Sn.