PURPOSE: To enhance adhesion and airtight at a metallization boundary of a through hole by forming a conductive metallization part of a high melting paint metal, in a multilayer circuit board having the conductive metllization part.

CONSTITUTION: In manufacture of a pin grid ARRAY (PGA) package, a specified through hole is opened on an AlN green sheet, and the through hole of the first layer 2 is packed with a high melting point packing tungsten paste 3 containing a silicon dioxide and magnesium oxide. And, the surface of the first layer 2 is printed with a print tungsten paste 4 containing a silicon dioxide and magnesium oxide. By baking these pastes 3 and 4 under a nitrogen atmosphere, the conductive metallization part having excellent adhesion is obtained. Packing and print tungsten pastes 6, 7:8, 9 are applied to the second layer 5 and the third layer 8 as well, and then baked to obtain a conductive metallization part.