Title:
MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP3786616
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a multilayer circuit board having high connection reliability and to provide a method for manufacturing the multilayer circuit board.
SOLUTION: This multilayer circuit board 100 is formed with conductor layers 1 and 7 configuring wiring circuits on both sides of an insulating layer 2. The respective wiring circuits formed on both sides are electrically connected through a via hole 2a where a solder conductor 8 is packed, and the side wall of the via hole 2a is shaped like irregularities.
Inventors:
Kei Nakamura
Satoshi Tanigawa
Toshikazu Baba
Satoshi Tanigawa
Toshikazu Baba
Application Number:
JP2002076569A
Publication Date:
June 14, 2006
Filing Date:
March 19, 2002
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H05K3/46; H05K1/11; H05K3/40; (IPC1-7): H05K3/46
Domestic Patent References:
| JP10335526A | ||||
| JP2001267738A | ||||
| JP7170046A | ||||
| JP2001237512A |
Attorney, Agent or Firm:
Noboru Fujimoto
Seiichi Yakumaru
Hiroaki Nakatani
Tokuya Iwata
Seiichi Yakumaru
Hiroaki Nakatani
Tokuya Iwata
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