Title:
MULTILAYER ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2022181177
Kind Code:
A
Abstract:
To provide a multilayer electronic component according to an exemplary embodiment of the present disclosure, which may control connectivity of an end of an internal electrode, thereby suppressing occurrence of a short circuit between the internal electrodes, reduced capacitance or lower breakdown voltage.SOLUTION: A multilayer electronic component 100 includes: a body 100 including a plurality of dielectric layers 111 and first and second internal electrodes 121 and 122 alternately disposed in a first direction with the dielectric layers 111 interposed therebetween, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first external electrode 131 disposed on the third surface and connected to the first internal electrode 121; and a second external electrode 132 disposed on the fourth surface and connected to the second internal electrode 122.SELECTED DRAWING: Figure 5
Inventors:
LEE JONG HO
MUN SON JAE
KIM GI LONG
LEE TAE GYEOM
AHN BYUNG ROK
CHA KYOUNG JIN
MUN SON JAE
KIM GI LONG
LEE TAE GYEOM
AHN BYUNG ROK
CHA KYOUNG JIN
Application Number:
JP2022076695A
Publication Date:
December 07, 2022
Filing Date:
May 06, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H01G4/30
Attorney, Agent or Firm:
Patent Attorney Corporation RYUKA International Patent Office