Multilayer electronic parts and a set board - MURATA MANUFACTURING CO.,LTD.

Title:

Multilayer electronic parts and a set board

Document Type and Number:

Japanese Patent JP6179097

Kind Code:

B2

Inventors:

Satoshi Asada
Shinya Watanabe
Kuniyoshi Muraoka
Kenji Ueda

Application Number:

JP2012280793A

Publication Date:

August 16, 2017

Filing Date:

December 25, 2012

Export Citation:

Assignee:

MURATA MANUFACTURING CO.,LTD.

International Classes:

H05K1/02; H05K3/00

Domestic Patent References:

Foreign References:

WO2010092969A1

Attorney, Agent or Firm:

Ascend Patent Business Corporation

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