Title:
多層フィルムの製造方法
Document Type and Number:
Japanese Patent JP7073638
Kind Code:
B2
Abstract:
To provide a multilayer film in which a film does not foam at film molding time at a high temperature, and transparency of the film is secured, and to provide a package.SOLUTION: A multilayer film 1 is formed by laminating, in this order, a moisture absorption layer 8 containing metal oxide, a pinhole-resistant layer 6 and an outer layer 2. Preferably, in the multilayer film 1, an average particle diameter of the metal oxide is 25-500 nm, and the content in the moisture absorption layer 8 is 0.05-20 mass%. In the multilayer film 1, a ratio of a thickness of the moisture absorption layer 8 to a total thickness is 3-80%.SELECTED DRAWING: Figure 1
Inventors:
Akiyoshi Otsuki
Application Number:
JP2017118950A
Publication Date:
May 24, 2022
Filing Date:
June 16, 2017
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
B32B9/00; B65D65/40
Domestic Patent References:
| JP2007069487A | ||||
| JP2015217987A | ||||
| JP2017513205A |
Attorney, Agent or Firm:
Sumio Tanai
Masato Iida
Naoshi Fukuhara
Masato Iida
Naoshi Fukuhara