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Title:
低インダクタンスビアアセンブリを備える多層フィルタ
Document Type and Number:
Japanese Patent JP7268161
Kind Code:
B2
Abstract:
A multilayer filter may include a dielectric layer having a top surface, a bottom surface, and a thickness in a Z-direction between the top surface and the bottom surface. The multilayer filter may include a conductive layer formed on the top surface of the dielectric layer. The multilayer filter may include a via assembly formed in the dielectric layer and connected to the conductive layer on the top surface of the dielectric layer. The via assembly may extend to the bottom surface of the dielectric layer. The via assembly may have a length in the Z-direction and a total cross-sectional area in an X-Y plane that is perpendicular to the Z-direction. The via assembly may have an area-to-squared-length ratio that is greater than about 3.25.

Inventors:
Choi, Kwan
Bellorini, Marianne
Application Number:
JP2021535565A
Publication Date:
May 02, 2023
Filing Date:
December 18, 2019
Export Citation:
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Assignee:
Kyocera Abuex Components Corporation
International Classes:
H01F27/00; H01F17/00; H01G4/40; H01P1/203; H03H7/075
Domestic Patent References:
JP2015106732A
JP2006521775A
JP2003264443A
JP2011507312A
JP2004007682A
JP2018196082A
JP2001210541A
JP2004281850A
JP11027075A
JP2008099060A
JP2006101500A
Foreign References:
WO2006134916A1
US20160172310
WO2014050239A1
Attorney, Agent or Firm:
Osamu Yamamoto
Toru Miyamae
Junichi Matsuo
Ayako Omaki