MULTILAYER INTERCONNECTION BOARD AND ITS MANUFACTURE

Title:

MULTILAYER INTERCONNECTION BOARD AND ITS MANUFACTURE

Document Type and Number:

Japanese Patent JP3109221

Kind Code:

B2

Abstract:

PURPOSE: To provide a multilayer interconnection board wherein its continuity reliability is high, its surface smoothness is good and its hardening temperature is comparatively low and to provide its manufacturing method.
CONSTITUTION: At least an insulating layer 7 on a first conductor layer 2 formed on a substrate 1 is constituted of a polymer composition; an insulating layer 8 at the outermost layer is constituted of a fiber-reinforced resin; openings 4 which expose the surface of a conductor interconnection in parts constituting the first conductor layer 2 or a second conductor layer 6 are formed in the insulating layers 7, 8; the individual conductor layers are connected by plated conductors formed on wall faces of the openings 4. It is possible to provide a multilayer interconnection board in which the difference in a coefficient of thermal expansion between the second conductor layer 6 at the outermost layer, a mounted component and the insulating layers 7, 8 is made, small, whose continuity reliability is enhanced, whose surface smoothness is good and in which the insulating layers 7, 8 can be made easily thick, and it is possible to provide its manufacturing method.

Inventors:

Yasuo Furuhashi
Toshiyuki Toyoshima
Takamitsu Fujimoto
Bunmei Baba

Application Number:

JP5131492A

Publication Date:

November 13, 2000

Filing Date:

March 10, 1992

Export Citation:

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