Title:
MULTILAYER PRINTED BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH04213894
Kind Code:
A
Abstract:
PURPOSE: To enable a multilayer printed board provided with circuit components mounted on its front and rear to be enhanced in mounting density by a method wherein through-holes provided to the printed board penetrating it through are comparatively lessened in number.
CONSTITUTION: An m (m≥2) layered printed board 36 and an n (n≥2) layered printed board 45 are formed and pasted together with a resin-containing material 46 into a (m+n) layered printed board 51, and a through-hole 49 is provided to the board 51 penetrating it through. Viaholes 35 and 55 are provided to the m layered printed board 36 and the n layered printed board 45 of the (m+n) layered printed board 51 respectively.
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Inventors:
HIROTA KATSUMI
Application Number:
JP40979190A
Publication Date:
August 04, 1992
Filing Date:
December 10, 1990
Export Citation:
Assignee:
SONY CORP
International Classes:
H05K3/46; (IPC1-7): H05K3/46
Attorney, Agent or Firm:
Hidekuma Matsukuma