Title:
MULTILAYER PRINTED INTERCONNECTION BOARD AND MANUFACTURE OF THE SAME
Document Type and Number:
Japanese Patent JPS63173391
Kind Code:
A
Inventors:
YASUI SUNAO
Application Number:
JP667987A
Publication Date:
July 16, 1988
Filing Date:
January 13, 1987
Export Citation:
Assignee:
NEC CORP
International Classes:
H05K3/46; (IPC1-7): H05K3/46
Attorney, Agent or Firm:
Uchihara Shin