Title:
多層プリント配線板
Document Type and Number:
Japanese Patent JP5574009
Kind Code:
B2
Abstract:
Multilayer printed wiring boards superior in formation of an ultrafine wiring, which can form a conductive layer superior in peel strength on a flat insulating layer surface, can be prepared by a method including the following steps (A)-(E): (A) a step of laminating a film with a metal film, wherein a metal film layer is formed on a support layer, on an internal-layer circuit substrate via a curable resin composition layer, or laminating an adhesive film with a metal film, wherein a curable resin composition layer is formed on a metal film layer of the film with a metal film, on an internal-layer circuit substrate; (B) a step of curing a curable resin composition layer to form an insulating layer; (C) a step of removing a support layer; (D) a step of removing a metal film layer; and (E) a step of forming a metal film layer on an insulating layer surface by electroless plating.
More Like This:
| JPH1051144 | MULTILAYER PRINTED-WIRING BOARD |
| JPS60113991 | MULTILAYER PRINTED BOARD |
| WO/2012/054169 | METHOD OF MAKING A MULTI-CHIP MODULE HAVING A REDUCED THICKNESS AND RELATED DEVICES |
Inventors:
Nara bridge Hirohisa
Shigeo Nakamura
Tadahiko Yokota
Shigeo Nakamura
Tadahiko Yokota
Application Number:
JP2013096244A
Publication Date:
August 20, 2014
Filing Date:
May 01, 2013
Export Citation:
Assignee:
Ajinomoto Co., Inc.
International Classes:
H05K3/46; H05K3/38
Attorney, Agent or Firm:
Takashima 1
Kyoko Doi
Kamata 光宜
Tamura Yasaka child
Kenji Yamamoto
Murata Miyuki
Koike 順造
Hirofumi Toma
Kyoko Doi
Kamata 光宜
Tamura Yasaka child
Kenji Yamamoto
Murata Miyuki
Koike 順造
Hirofumi Toma