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Title:
MULTILAYER RESIN SHEET, RESIN SHEET LAMINATE, MULTILAYER RESIN SHEET CURED PRODUCT AND METHOD FOR PRODUCING THE SAME, MULTILAYER RESIN SHEET WITH METAL FOIL, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2017019291
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a multilayer resin sheet capable of forming a multilayer resin sheet cured product that is excellent in all of thermal conductivity, adhesive strength and insulating performance.SOLUTION: A multilayer resin sheet has a resin composition layer comprising thermosetting resin and filler, and an adhesive layer that is disposed on at least one side of the resin composition layer, with its side not facing the resin composition layer having an arithmetic mean surface roughness Ra of 1.5 μm or less.SELECTED DRAWING: None

Inventors:
NISHIYAMA TOMOO
KUWANO ATSUSHI
SHIRASAKA TOSHIAKI
AWANO YASUHIKO
Application Number:
JP2016205005A
Publication Date:
January 26, 2017
Filing Date:
October 19, 2016
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B32B27/20; B32B15/092; B32B27/26; B32B27/38; C09J7/20; H01L23/36; H01L23/373
Domestic Patent References:
JP5141853B22013-02-13
JP2010258430A2010-11-11
JP2009021530A2009-01-29
JP2008266378A2008-11-06
JP2008153430A2008-07-03
JP2007262398A2007-10-11
Foreign References:
WO2010024236A12010-03-04
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office