Title:
MULTILAYER SUBSTRATE AND ELECTRONIC APPARATUS USING THE SAME, AND PROCESS OF MANUFACTURING MULTILAYER SUBSTRATE
Document Type and Number:
Japanese Patent JP2014220310
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To delay a crack generated in a build-up layer to reach inner layer wiring.SOLUTION: A build-up layer 30 is formed by being mixed with at least one of rod-like, flat, phosphorus piece like additives 34 in addition to a spherical filler 33 that controls a thermal expansion coefficient in resin 32. The additives 34 are disposed in the resin 32 so that a longer direction and a normal direction at one surface 30a of the build-up layer 30 cross.
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Inventors:
MIZUKAMI MARIKO
NAKAMURA TOSHIHIRO
NAKAMURA TOSHIHIRO
Application Number:
JP2013097232A
Publication Date:
November 20, 2014
Filing Date:
May 06, 2013
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L23/12; H05K3/46
Domestic Patent References:
| JPH10135644A | 1998-05-22 | |||
| JP2001119150A | 2001-04-27 | |||
| JP2001119153A | 2001-04-27 | |||
| JP2005347358A | 2005-12-15 |
Foreign References:
| WO1990001860A1 | 1990-02-22 |
Attorney, Agent or Firm:
Patent business corporation ゆうあい patent firm