Title:
多層テープ
Document Type and Number:
Japanese Patent JP7022118
Kind Code:
B2
Abstract:
The present invention relates to a tape for damping (100), the tape comprising a first substrate (110); a second substrate (130); a first layer of viscoelastic damping material (120); and a second layer of viscoelastic damping material (140), and a constrained layer system (300) comprising at least one of a first component and a second component (170) undergoing vibration; and the tape for damping (100).
Inventors:
Meckler, Joseph El
Milliman, Henry W
Ganesan, Mahesh
Johnson, Luke N
Milliman, Henry W
Ganesan, Mahesh
Johnson, Luke N
Application Number:
JP2019513757A
Publication Date:
February 17, 2022
Filing Date:
September 20, 2017
Export Citation:
Assignee:
Avery Dennison Corporation
International Classes:
C09J7/38; B32B7/022; C09J7/28; C09J201/00; F16B11/00; F16D65/095; F16F1/36; F16F15/08
Domestic Patent References:
| JP5318644A | ||||
| JP8170688A | ||||
| JP10503575A | ||||
| JP6064089A | ||||
| JP2006199759A | ||||
| JP2014529525A |
Attorney, Agent or Firm:
Hiroe Associates Patent Office