Title:
MULTILAYER TYPE MOLDED BODY AND ONBOARD ELECTRONIC CONTROL UNIT
Document Type and Number:
Japanese Patent JP2019130835
Kind Code:
A
Abstract:
To provide a molded body having light weight and high in freedom degree for design while having electromagnetic wave shielding property or heat release property, for overcoming problems with a molded body having a layer made by metal-processing a body, and a layer made by processing plastic that freedom for design is lower than resin made one and weight is heavy.SOLUTION: There is provided a multilayer type molded body formed by using at least two kinds of resin, and having at least one each of a layer formed by a heat-conductive resin and a layer formed by a conductive resin.SELECTED DRAWING: Figure 2
Inventors:
YOKOO YUJI
MAEDA ATSUSHI
WATANABE YOSHITERU
HAGA TAKESHI
ABE YUICHI
MAEDA ATSUSHI
WATANABE YOSHITERU
HAGA TAKESHI
ABE YUICHI
Application Number:
JP2018016007A
Publication Date:
August 08, 2019
Filing Date:
January 31, 2018
Export Citation:
Assignee:
IBUKI INC
International Classes:
B32B27/00; B32B3/30; F02B77/11
Domestic Patent References:
| JP2010245407A | 2010-10-28 | |||
| JP2016186972A | 2016-10-27 |
Attorney, Agent or Firm:
Kosuke Suzuki