Title:
MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2005064357
Kind Code:
A
Abstract:
To a multilayer wiring board which can obtain higher wiring flexibility, can reduce a material cost, attain a reduced board capacity, and have high bending resistance strength (peel resistance strength), and a method for manufacturing the wiring board.
At least two substrates among substrates 21A, 21B and 21C, outer shapes of which are previously processed and which have single-side wiring circuits, are bonded to a printed circuit motherboard 10, and the substrates are electrically connected at least at one location via an inner via. Outer shapes of the substrates 21A, 21B and 21C are smaller than the outer shape of the motherboard 10. The substrates 21A, 21B and 21C form an island when stacked on the motherboard 10 in a pyramid.
Inventors:
KISHIHARA RYOICHI
ITO SHOJI
NAKAO SATORU
ITO SHOJI
NAKAO SATORU
Application Number:
JP2003294994A
Publication Date:
March 10, 2005
Filing Date:
August 19, 2003
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
H05K3/46; (IPC1-7): H05K3/46
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Shunichi Takahashi
Iwa Saki Kokuni
Kawamata Sumio
Shunichi Takahashi
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