To provide a multilayer wiring board which can be reduced in size and has high-density wiring by using a thin film wiring conductor formed by thin-film forming technology and forming a capacitive element inside for the wiring conductor.

A multilayer wiring board is constituted of a multilayer wiring section 2 which is made by alternately locating thin-film wiring conductors 4a, 4b, 4c and connecting them via through-hole conductors 9, located in organic resin insulating layers 3a, 3b, 3c, and a capacitive element A which is made by adding a dielectric filler having a relative permittivity of 20 of larger in a part of at least one organic resin insulating layer 3b for turning that part into an organic resin insulating layer of high relative permittivity, and by letting that part to be faced opposite the parts of the thin-film wiring conductors 4a, 4b, and which is electrically connected between the thin-film wiring conductors 4a and 4b. The thin-film wiring conductor 4b is jointed to an upper face of the organic resin insulating layer of high relative permittivity, through a nickel layer 10 and the thin-film wiring conductor 4a, which has a surface roughness expressed by a relation 0.05μm≤Ra≤5μm, where Ra is a center line average height, is directly jointed to the lower face of the organic resin insulating layer of high relative permittivity.