Title:
多層配線構造体及び多層配線構造体を用いた半導体装置
Document Type and Number:
Japanese Patent JP7390323
Kind Code:
B2
Abstract:
To provide a multilayer wiring structure with improved resistance against the separation between a wiring layer and an insulating layer.SOLUTION: A multilayer wiring structure includes a plurality of wiring layers, a plurality of insulating layers for insulating each of the wiring layers, a first region, a second region adjacent to the first region, and a multilayer wiring circuit provided in the first region. The insulating layers extend from the first region to the second region. A part of the wiring layers does not exist in the second region. The number of layers in the wiring layers in the second region is smaller than that in the first region. In the second region, the insulating layers on and under the part of the wiring layers are in contact with each other.SELECTED DRAWING: Figure 3
Inventors:
Takano Takano
Hiroshi Kudo
Hiroshi Kudo
Application Number:
JP2021003112A
Publication Date:
December 01, 2023
Filing Date:
January 12, 2021
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H05K3/46; H01L23/12
Domestic Patent References:
| JP2009246144A |
Attorney, Agent or Firm:
Patent Attorney Corporation Takahashi Hayashi and Partners