MULTILAYERED SOLID-STATE IMAGE SENSING DEVICE

Title:

MULTILAYERED SOLID-STATE IMAGE SENSING DEVICE

Document Type and Number:

Japanese Patent JPH08204166

Kind Code:

A

Abstract:

PURPOSE: To improve the nonuniformity of bump pressure-bonding and increase the yield at the time of bump pressure-bonding.

CONSTITUTION: A photoelectric conversion film 3 is formed on a light transmitting substrate 1 having a transparent electrode 2, and a photoelectric conversion part 5 is constituted by arranging signal lead-out electrodes 4. Source parts 7 are formed on a semiconductor substrate 6, and picture element electrodes 9 which are connected with the source parts 7 via interlayer insulating films 8 are formed. Bump pillars 10 which are not transformed at the time of pressure-bonding are formed on the picture element electrodes 9, conductive micro bumps 12 are formed by sticking conductive films 11 which are transformed at the time of compression-bonding on the surfaces of the bump pillars 10, and a scanning circuit part 13 is constituted. The conductive micro bumps 12 of the scanning circuit part 13 are compression-bonded to the signal leading-out electrodes 4 of the photoelectric conversion part 5, and a multilayered solid-state image sensing device is constituted.

Inventors:

ARAKI SHUICHI
ANDO FUMIHIKO
KOSUGI MITSUO
MARUYAMA HIROTAKA

Application Number:

JP2580495A

Publication Date:

August 09, 1996

Filing Date:

January 23, 1995

Export Citation:

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Assignee:

JAPAN BROADCASTING CORP
OLYMPUS OPTICAL CO

International Classes:

H01L21/60; H01L21/321; H01L21/603; H01L27/146; (IPC1-7): H01L27/146; H01L21/321; H01L21/60; H01L21/603

Attorney, Agent or Firm:

Kenji Mogami

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