Title:
Multi-layer wiring structure
Document Type and Number:
Japanese Patent JP6330374
Kind Code:
B2
More Like This:
Inventors:
Takamasa Takano
Hiroshi Kudo
Hiroshi Kudo
Application Number:
JP2014041294A
Publication Date:
May 30, 2018
Filing Date:
March 04, 2014
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L21/768; H01L23/532
Domestic Patent References:
| JP2011258871A | ||||
| JP2006173333A | ||||
| JP2000311982A | ||||
| JP2000100808A | ||||
| JP2004014901A | ||||
| JP2010212439A | ||||
| JP2009016575A | ||||
| JP2002204078A | ||||
| JP2011192774A |
Attorney, Agent or Firm:
Takahashi Hayashi & Partners