Title:
多室型熱処理装置
Document Type and Number:
Japanese Patent JP5658928
Kind Code:
B2
Abstract:
A multi-chamber heat treatment device (S1) includes a plurality of treatment chambers having a heat treatment chamber, the device including: a cooling chamber (3) serving as the heat treatment chamber configured to cool a treatment target by latent heat of liquid particles; treatment chambers (1, 2) different from the cooling chamber (3); and drying devices (11, 19) configured to dry the cooling chamber (3).
Inventors:
勝俣 和彦
Application Number:
JP2010151563A
Publication Date:
January 28, 2015
Filing Date:
July 02, 2010
Export Citation:
Assignee:
株式会社ＩＨＩ
株式会社ＩＨＩ機械システム
株式会社ＩＨＩ機械システム
International Classes:
F27B9/02; C21D1/00; F27B9/06; F27B9/10; F27B9/12; F27B9/18; F27B9/26; F27B9/36; F27B17/00; F27D7/02; F27D9/00; F27D11/08
Attorney, Agent or Firm:
Masatake Shiga
Horiuchi Right A
Horiuchi Right A
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