Title:
MULTIPOINT CONNECTION METHOD AND MULTIPOINT CONNECTION MEMBER
Document Type and Number:
Japanese Patent JP3138200
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enhance the freedom of circuit design by a simple configuration, and obtain a connection high in certainty and reliability.
SOLUTION: A plurality of lengthwise flat-shaped multipoint conductors 13 are fixed within an insulating cover body 15, and opening parts 17 coming in contact with the surfaces of the multipoint conductors 13 are provided for the surface of the cover body 15. A plurality of the opening parts 17 are formed along the respective multipoint conductors 13, and a branch connecting member 11 is provided, in which the opening parts are arranged roughly in a lattice shape. By this constitution, either one of a plurality of the opening parts 17 is selected, and the conductor part of a circuit is deposited to the multipoint conductors 13 through conductive material filled in the opening parts 17.
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| JP2000286004 | OUTLET |
| JPH07193963 | INSULATING PLUG |
Inventors:
Masuo Sugiura
Application Number:
JP30775295A
Publication Date:
February 26, 2001
Filing Date:
November 27, 1995
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
H01R4/70; H01R9/03; H05K1/00; H05K3/36; (IPC1-7): H01R12/08; H01R4/70; H01R9/03
Domestic Patent References:
| JP7263050A | ||||
| JP817259A | ||||
| JP7282870A | ||||
| JP442090U |
Attorney, Agent or Firm:
Hidekazu Miyoshi (8 outside)