Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP3010924
Kind Code:
B2
Abstract:
PURPOSE:To enhance a molded type semiconductor device equipped with semiconductor chips in reliability. CONSTITUTION:A lead frame is equipped with support plates 2a to 2f where semiconductor chips 11a to 11f are fixed and a wiring conductor board 4 where the chips 11a to 11f are interconnected. A heat sink 13, equipped with first conductor layers 31a to 31f and second conductor layers 32a to 32f provided onto a heat sink through the intermediary of a thin insulating layer 13b, is arranged on support plates 2 and the wiring conductor board 4. The wiring board 4 is fixed to the second conductor layers by soldering. Therefore, the wiring conductor board 4 is supported by the second conductor layers in a sporadic manner.
More Like This:
| WO/2023/100517 | CIRCUIT MODULE |
| JP3287408 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING CONDUCTOR PIERCING SEMICONDUCTOR SUBSTRATE |
| JPH0629428 | SEMICONDUCTOR DEVICE |
Inventors:
Kazumi Takahata
Application Number:
JP23636292A
Publication Date:
February 21, 2000
Filing Date:
August 11, 1992
Export Citation:
Assignee:
Sanken Electric Co., Ltd.
International Classes:
H01L23/28; H01L23/50; (IPC1-7): H01L23/28; H01L23/50
Attorney, Agent or Firm:
Noritsugu Takano