Title:
【発明の名称】半導体集積回路の製造方法
Document Type and Number:
Japanese Patent JP3064993
Kind Code:
B2
Inventors:
Toshihiro Kato
Keiichi Okada
Keiichi Okada
Application Number:
JP29893097A
Publication Date:
July 12, 2000
Filing Date:
October 30, 1997
Export Citation:
Assignee:
NEC
International Classes:
H01L21/768; H01L21/316; H01L21/3205; H01L21/66; H01L23/52; (IPC1-7): H01L21/768; H01L21/316; H01L21/3205; H01L21/66
Domestic Patent References:
| JP6377139A | ||||
| JP6442152A | ||||
| JP61252641A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)