Title:
【発明の名称】相互連結回路基板を有する半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP3011510
Kind Code:
B2
Abstract:
A semiconductor device having an interconnecting circuit board comprises an island (20) formed in a predetermined plane, a semiconductor chip (21) disposed on the island (20) and having a plurality of electrically connecting electrode pads (22), an interconnecting circuit board (23) disposed on the semiconductor chip (20) and having an electrically conductive pattern (27), a plurality of inner leads (25) disposed around the island (20), a first electrically connecting wire (26c) connecting the electrically conductive pattern (27) and one (22b) of the plurality of electrically connecting electrode pads (22), and a second electrically connecting wire (26a,26b) connecting the electrically conductive pattern (27) and one (25a) of the inner leads (25).
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Inventors:
Junya Nagano
Application Number:
JP32614891A
Publication Date:
February 21, 2000
Filing Date:
December 10, 1991
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L23/52; H01L23/495; H01L25/04; H01L25/065; H01L25/18; (IPC1-7): H01L23/50; H01L23/52; H01L25/04; H01L25/18
Domestic Patent References:
| JP1106436A |
Attorney, Agent or Firm:
Kazuo Sato (3 others)