Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP3082714
Kind Code:
B2
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Inventors:
Toshio Watanabe
Application Number:
JP19437597A
Publication Date:
August 28, 2000
Filing Date:
July 18, 1997
Export Citation:
Assignee:
NEC
International Classes:
H01L27/04; H01L21/822; (IPC1-7): H01L27/04; H01L21/822
Domestic Patent References:
| JP1286459A | ||||
| JP63172468A | ||||
| JP878629A |
Attorney, Agent or Firm:
Naka Kanno