Title:
METHOD FOR CONTROLLING POWER SOURCE FOR ELECTRODEPOSITION
Document Type and Number:
Japanese Patent JP3028449
Kind Code:
B2
Abstract:
PURPOSE: To easily form stable films without being affected by treating areas by digitally recording the inter-electrode voltage when the desired film is formed in the case of electroplating, etc., and setting the voltage at the inter-electrode voltage under this condition.
CONSTITUTION: The thicknesses of electrodeposition plating films or dispersion plating films have a correlative relation with the quantity of electricity passing between the electrodes within a plating liquid in the case of electroplating, dispersion plating, etc., and, therefore, a current detector is inserted between a power source and the electrodes and the detection signal thereof is added to an integrator which in turn monitors the quantity of electricity in the process for formation of the plating films. On the other hand, the patterns corresponding to the desired film plating speed are generated analogically or digitally. The signal patterns thereof and the patterns of the integrated value of the current flowing to the electrodes are compared and the current or voltage between the electrodes is automatically controlled so as to minimize the difference therebetween, by which the plating films are formed at the desired speed and the quantity of electricity for formation of the plating films is exactly measured. The plating films of the desired thicknesses are automatically formed regardless of the areas of the materials to be plated.
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Inventors:
Akira Hasegawa
Application Number:
JP14129893A
Publication Date:
April 04, 2000
Filing Date:
May 21, 1993
Export Citation:
Assignee:
Takasago Manufacturing Co., Ltd.
International Classes:
C25D21/12; (IPC1-7): C25D21/12