PURPOSE: To enable a short-circuiting defect portion to be corrected automatically and without damaging a polyimide film for a thin-film substrate correction device which is used for correcting a substrate with a highly dense wiring pattern.
CONSTITUTION: In a thin-film substrate correction device which cuts a defect pattern where a defect is generated out of a wiring pattern 30 which is formed on a substrate 24 with a thin-film layer and has a specified thickness using a cutter 26, height-detection devices (measurement/cutting unit, inspection device control portion) 27 and 29 which detect a height of an upper surface of a wiring pattern 30 and the measurement/cutting unit 27 which performs cutting with a height of an upper surface of the wiring pattern 30 which is detected by the height-detection devices 27 and 29 as a zero point and then cuts a defect pattern are provided.
SEKIGUCHI HIDENORI
KAMATA TORU
TABATA FUMIO
