Title:
SEMICONDUCTOR MANUFACTURING DEVICE
Document Type and Number:
Japanese Patent JP3037047
Kind Code:
B2
Abstract:
PURPOSE: To prevent an etching rate difference, an etched shape difference, and a local resist burning from occurring due to a temperature difference that happens in the plane of a wafer and between wafers when a dry etching process is carried out.
CONSTITUTION: Wafer temperature monitoring sensors 10a to 10e are arranged on the wafer contacting spots of a lower electrode 3 on which a wafer 1 is placed and wafer clamps 2 which clamp the wafer 1, clamp actuating air cylinders 11a to 11d are so controlled as to increase or decrease the wafer clamps 2 in clamping force basing on the signals sent from the temperature monitoring sensors 10a to 10e, whereby a temperature difference in the plane of a wafer can be eliminated, and wafer cooling helium 4 controlled in flow rate by a mass flow controller 5 is made to flow over the wafer 1 to set it to a prescribed temperature.
Inventors:
Youichi Matsuda
Application Number:
JP31862893A
Publication Date:
April 24, 2000
Filing Date:
December 17, 1993
Export Citation:
Assignee:
Yamaguchi NEC Corporation
International Classes:
H01L21/302; H01L21/3065; H01L21/68; H01L21/683; (IPC1-7): H01L21/3065; H01L21/68
Domestic Patent References:
| JP6132510A | ||||
| JP1204424A | ||||
| JP529222A | ||||
| JP31531U |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)