PURPOSE: To provide a package for semiconductor element in which a capacitive element does not exfoliate from an insulating base and protected against crack or breakage while furthermore bonding of the capacitive element to the insulating base causes no deterioration of insulating characteristics of the capacitive element.

CONSTITUTION: The package for semiconductor element comprises an insulating base body 1 having a recess 1A for containing a semiconductor element and a cover body 3 wherein a capacitive element 2 having basic body 2a of tantalum applied with a dielectric layer 2b of tantalum oxide formed through anodic oxidation is bonded through brazing material having melting point of 400°C or below or conductive resin to the bottom face of a recess 1A made in the insulating base body 1.