ABS RESIN COMPOSITION HAVING IMPROVED PROCESSABILITY

Title:

ABS RESIN COMPOSITION HAVING IMPROVED PROCESSABILITY

Document Type and Number:

Japanese Patent JPH059361

Kind Code:

A

Abstract:

PURPOSE:To provide the subject composition composed of ABS resin and a specified amount of a specified oligoamide compound blended therewith, capable of producing a molding excellent in surface properties, free from lowering of thermal deformation temperature of the resin and capable of blending vinyl chloride resin without a danger of peeling. CONSTITUTION:An objective composition obtained by blending (A) 100 pts.wt. ABS resin with (B) 0.01-20 pts.wt. (preferably 0.05-10 pts.wt.) oligoamide compound represented by formula R1-(-CO-R3-CO-NH-R4-NH-)n-(CO-R5-NH-)n-R2 (R1 is HO-, NH2-R4-NH-, R6-NH- or R7-CO-NH-R4-NH-; R2 is -H, -CO-R7, -CO-R3- OH or -CO-R3-CO-NH-R6; R3-R5 are 1-12C alkylene; R6 and R7 are 1-18C alkyl; m and n are 0-40 and m+n=2-40) and preferably having 60-300 deg.C softening point.

Inventors:

TSURIGA KOJI
TSUBOI TETSUO

Application Number:

JP16151391A

Publication Date:

January 19, 1993

Filing Date:

July 02, 1991

Export Citation:

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Assignee:

ASAHI DENKA KOGYO KK

International Classes:

C08K5/20; C08L55/00; C08L55/02; (IPC1-7): C08K5/20; C08L55/02

Attorney, Agent or Firm:

Osamu Hatori

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