PURPOSE: To provide an image pick-up device having a sufficient dielectric strength and without a smear or a white flaw in a reproduced image.
CONSTITUTION: A p-type well 2 is formed on a silicon substrate 1. An n--type region 3 and a p-type region 4 for a photodiode, and an n-type region 5, a p+-type region 6, and a p+-type region 7 for a vertical CCD unit are formed in the p-type well 2, and also a p++-type region 8 is formed on the n--type region for the photodiode. Moreover, a gate oxide film 9, a silicon nitride film 10, and a polysilicon electrode 11 are provided on the silicon substrate 1. On the surface of the polysilicon electrode 11, a polysilicon oxide film 21, a silicon nitride film 22, and an upper oxide film 23 are formed. The upper oxide film 23 has been formed in a thermal oxidation step from a silicon nitride film 22.
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