Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2500938
Kind Code:
B2
Inventors:
HISAMOTO YOSHIAKI
Application Number:
JP29522188A
Publication Date:
May 29, 1996
Filing Date:
November 22, 1988
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L29/78; H01L27/04; (IPC1-7): H01L29/78
Domestic Patent References:
| JP62211954A | ||||
| JP62186565A | ||||
| JP60171771A | ||||
| JP55141748A |
Attorney, Agent or Firm:
Shigeaki Yoshida (2 outside)