Title:
MODIFIER FOR ADHESIVE AND HOT-MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP3041687
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a modifier which, when added to, especially, a rubber-based hot-melt adhesive, can give a hot-melt adhesive composition having improved cohesive force and holding power, not suffering from plasticizer bleeding, and exhibiting excellent adhesive force to a polyolefin material being a difficultly bondable material and to provide a hot-melt adhesive composition containing the same.
SOLUTION: There are provided a modifier for an adhesive, comprising a copolymer (A) essentially consisting of constituent monomers including a styrenic monomer (a1) and a 4-20C aliphatic or alicyclic unsaturated hydrocarbon compound (a2) and having a number-average molecular weight of 500-5,000 and a glass transition temperature (Tg) of 20°C or below and a hot-melt adhesive composition containing the same. In an embodiment, copolymer A is a copolymer comprising 30-90 wt.% monomer (a1), 10-79 wt.% monomer (a2), and 0-10 wt.% other monomers (a3). In another embodiment, copolymer A has a molecular weight distribution of 1.3-2.5 as measured by GPC. In yet another embodiment, copolymer A has a solubility parameter(SP) value of 8-11.
Inventors:
Naofumi Horike
Application Number:
JP21649898A
Publication Date:
May 15, 2000
Filing Date:
July 14, 1998
Export Citation:
Assignee:
SANYO CHEMICAL INDUSTRIES,LTD.
International Classes:
C09J121/00; C09J109/06; C09J123/08; C09J125/08; (IPC1-7): C09J125/08; C09J109/06; C09J123/08
Domestic Patent References:
| JP83526A | ||||
| JP6228529A | ||||
| JP6184249A | ||||
| JP517735A | ||||
| JP8269417A | ||||
| JP848731A | ||||
| JP53117034A | ||||
| JP53138449A | ||||
| JP1139665A |
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