Title:
SEMICONDUCTOR DEVICE AND BONDING METHOD
Document Type and Number:
Japanese Patent JPH0677279
Kind Code:
A
Abstract:
PURPOSE: To provide a device which is lessened in area and enhanced the number of devices produced per wafer and a bonding method of enabling the device to be realized.
CONSTITUTION: Dicing is carried out so as to make a dicing line 8 pass over the exposed part of a pad 2, and an inner lead 4 is directly bonded to the exposed pad 2 for the formation of a semiconductor device.
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Inventors:
TOYOKAWA TAKESHI
Application Number:
JP22955292A
Publication Date:
March 18, 1994
Filing Date:
August 28, 1992
Export Citation:
Assignee:
KAWASAKI STEEL CO
International Classes:
H01L21/60; H01L21/301; H01L21/78; H01L23/50; (IPC1-7): H01L21/60; H01L21/78; H01L23/50
Attorney, Agent or Firm:
Eiichi Kobayashi
Next Patent: METHOD OF MOUNTING SEMICONDUCTOR CHIP