【発明の名称】半導体パッケージ用のセラミック製リッド

Title:

【発明の名称】半導体パッケージ用のセラミック製リッド

Document Type and Number:

Japanese Patent JP3091344

Kind Code:

B2

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Inventors:

Kazuo Kimura
Haruhiko Murata
Koji Sugawara
Yukihiro Aoyama

Application Number:

JP8939493A

Publication Date:

September 25, 2000

Filing Date:

March 23, 1993

Export Citation:

Assignee:

Nippon Special Ceramics Co., Ltd.

International Classes:

H01L23/02; H01L23/04; (IPC1-7): H01L23/02

Domestic Patent References:

Attorney, Agent or Firm:

Kazuhisa Kato

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