Title:
【発明の名称】電子部品実装方法
Document Type and Number:
Japanese Patent JP3070221
Kind Code:
B2
Inventors:
Shinsuke Sakaguchi
Shigeru Eguchi
Shigeru Eguchi
Application Number:
JP1380092A
Publication Date:
July 31, 2000
Filing Date:
January 29, 1992
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B08B3/12; B23P21/00; H05K13/04; (IPC1-7): H05K13/04
Domestic Patent References:
| JP234999A | ||||
| JP61252643A | ||||
| JP2170600A | ||||
| JP5748672U |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)