PURPOSE: To ensure electrical conduction with a metallic member such as a case to be mounted on a printed circuit board and with solder projected sections.

CONSTITUTION: By increasing gradually the height of solder projected sections 13 on a printed circuit board 11 in the region A near a fixing screw 15, the region B which is located a little far from the region A, and the region C which is located farther from the region A, respectively, conduction between solder projected sections 13 and the metallic member 14 can be ensured at the time of fixing the metallic member 14 by the fixing screw 15, even if the printed circuit board 11 is warped upward to the edges from the beginning. The manufacture of the solder projected sections 13 is as follows: a land pattern 12 is provided on the printed circuit board 11, and a reflow mask having openings with different sizes are arranged on the land pattern 12, and solder reflowing is done. As a result, the height of some of the solder projected sections 13 increases in case of a large opening, and the height of other solder projected sections 13 declines in case of a small opening.