Title:
【発明の名称】半導体基板のエッチング方法
Document Type and Number:
Japanese Patent JP2598578
Kind Code:
B2
Inventors:
Yoshizo Saito
Application Number:
JP11951291A
Publication Date:
April 09, 1997
Filing Date:
April 23, 1991
Export Citation:
Assignee:
Honda motor industry stock company
International Classes:
H01L21/306; (IPC1-7): H01L21/306
Attorney, Agent or Firm:
Yoichiro Shimoda (2 outside)