PURPOSE: To improve wettability to solder at an end of an outer lead, to improve a soldering strength and to eliminate a deformation of the lead by bending the end of the lead at a special angle in a reverse direction to a lead mounting surface.

CONSTITUTION: An end bent part 3 of an outer lead 2 is provided at the end of the lead 2, and the cut surface of the end of the lead is directed reversely to a printed board 7 of a printed board 6 so that a material exposed part of the cut surface is not brought into direct contact with solder paste 5. The end of the lead is bent at an angle of 90 degrees or more with respect to a mounting surface. Thus, a fitting of solder paste can be easily formed even at the end of the lead at the time of mounting on the printed board. A position of the end of the lead can be recognized by imaging when it is projected from above the board, thereby performing an automatic mounting.