PURPOSE: To obtain a polyamide resin composition useful as a material for household electric appliances, electrical and electronic devices, etc., having excellent mechanical strength, heat, water and solvent resistances, comprising a polyamide resin and an inorganic filler subjected to surface treatment.
CONSTITUTION: This composition comprises (A) 20-98wt.% of a polyamide resin (e.g. polyamide 6, polyamide 66 or polyamide 6-66) and (B) 80-2wt.of an inorganic filler (e.g. iron oxide or glass fibers) subjected to surface treatment with at least one of mercaptosilane-based compounds of formula I to formula IV (R1, R2 amd R3 are 1-10C alkyl; R4 is H or methyl; (n1) is 1-15; (n2) is 0 or 1-3; group of formula V is group of formula VI, etc.){e.g. 5-[1-THIO-4-(trimethoxysilyl) butyl]-2,3-bicyclo [2,2,1]heptadicarboxylic acid.
TAKEDA TADASHI
MARUYAMA SATOSHI
