Title:
【発明の名称】テープ型半導体装置組立用キャリア、およびテープ型半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3070563
Kind Code:
B2
Inventors:
Kazutaka Shoji
Application Number:
JP566898A
Publication Date:
July 31, 2000
Filing Date:
January 14, 1998
Export Citation:
Assignee:
NEC
International Classes:
H01L21/60; H01L21/50; (IPC1-7): H01L21/50; H01L21/60
Attorney, Agent or Firm:
Nobuyuki Kaneda (2 others)