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Title:
ROTATIONAL CUTTING MACHINING METHOD AND SPINDLE DEVICE USED FOR IT
Document Type and Number:
Japanese Patent JP3072253
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a method for performing cutting machining for a work by rotating a rotational cutting tool and eccentrically oscillating it in the small radius, and a spindle device.
SOLUTION: The axis of an input shaft 13 rotatably supported to a spindle holder 3 and the axis of an eccentric hole 23H of an eccentric coilar 23 rotatably supported to the spindle holder 3 are so provided as to be made eccentric by the small radius. A chuck device 37 capable of freely attaching and detaching a rotational cutting tool 39 to and from an output shaft 27 rotatably supported to the eccentric hole 23H is provided, and the output shaft 21 and the input shaft 13 are provided so as to be interlocked with and connected to each other through a universal joint 29, and an accelerating mechanism for accelerating and rotating the eccentric collar 23 is provided between the input shaft 13 and the eccentric collar 23.


Inventors:
Yoshihiko Ono
Application Number:
JP24195995A
Publication Date:
July 31, 2000
Filing Date:
September 20, 1995
Export Citation:
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Assignee:
Tokiwa Co., Ltd.
International Classes:
B23Q5/04; B23B35/00; B23C9/00; B23D75/00; (IPC1-7): B23Q5/04; B23B35/00; B23C9/00; B23Q5/04
Domestic Patent References:
JP487763A
Attorney, Agent or Firm:
Hidekazu Miyoshi (8 outside)