PURPOSE: To obtain a chip component, which is easily confirmed by a visual observation in the case where the chip component is mounted reversely on a substrate, and the mounting structure of the chip component on the substrate.

CONSTITUTION: The form of the surface, which comes into contact with a pattern 4 for connection use, of an electrode 1 is formed into a rectangle extended to the other side of a chip component, a mark 5 for reverse mounting confirmation use is kept being put on a substrate 7 and in the case where the chip component is rightly mounted on the substrate, this mark 5 is not seen and in the case where the chip component is reversely mounted by mistake, the chip component 2 is moved in the right direction and is secured on the substrate by a surface tension of solder at the time of solder-fusing on the surface of the pattern 4. As a result, as the mark 5 is brought in a state that it is seen, an erroneous mounting of the component 2 can be confirmed at a glance.