Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2524453
Kind Code:
B2
Abstract:
PURPOSE: To obtain the title composition for use in a low-permittivity laminate excellent in heat resistance, toughenss, flame retardancy and adhesion by mixing a specified modified cyanate resin with a polyphenylene ether and a brominated epoxy resin.
CONSTITUTION: The title composition comprises a modified cyanate resin prepared by reacting a dicyanate ester compound of the formula [wherein R1 is-CH2--C(CH3)2-, -C(CF3)2-, -CH(CH3)-, -O--S-or a direct bond; and R2 and R3 are each-H, -CH3 -C2H5 or-CF3] with at least one modified resin selected from the group consisting of a phenol-modified petroleum resin and a phenol-modified polybutadiene resin (e.g. phenol-modified 9 C petroleum resin), a polyphenylene ether [e.g. poly(2,6-dimethylphenylene ether)[ and a brominated epoxy resin (e.g. brominated bisphenol A epoxy resin).
Inventors:
Naofumi Enoki
Kenichi Suzuki
Kenichi Suzuki
Application Number:
JP15364192A
Publication Date:
August 14, 1996
Filing Date:
June 12, 1992
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/30; C08G59/00; C08G73/00; C08L63/00; H01L23/29; H01L23/31; H05K1/03; (IPC1-7): C08G59/30; C08G73/00; C08L63/00; H01L23/29; H01L23/31