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Patent Searching and Data


Title:
FORMING METHOD AND FORMING DIE FOR SYNTHETIC RESIN HOLLOW MOLDED BODY
Document Type and Number:
Japanese Patent JP2584575
Kind Code:
B2
Abstract:

PURPOSE: To provide a hollow molded body which has an excellent strength at the joined part by a method wherein on the sheet pinching surfaces of dies, two rows of, internal and external, protruding straps for pinch-off are provided, and the part of a resin sheet which is pinched between the internal and external protruding straps at the time of forming is made to overflow to the inside of the dies.
CONSTITUTION: Internal protruding straps 20, 21 and external protruding straps 22, 23 for pinch-off are provided in two rows with resin reservoir recessed parts 24, 25 between them, at both end edges of sheet pinching surfaces 17, 18 at leading ends of sheet pinching parts 3a, 4a of dies 3, 4. The dies 3, 4 approach sheets 1, 2 from the top and bottom, and when the dies pinch the sheets by both sheet pinching surfaces 17, 18, the external protruding straps 22, 23 deeply bite into the sheets preceding the internal protruding straps 20, 21. Then, as the resin reservoir recessed parts 24, 25 are filled with the resin of the sheets 1, 2, an excessive part of the resin overflows to the outside from the recessed parts 24, 25. By this method, a hollow molded body which is superior in joining strength can be obtained.


Inventors:
OKADA MITSUNORI
NAITO KAZUNORI
Application Number:
JP24079592A
Publication Date:
February 26, 1997
Filing Date:
September 09, 1992
Export Citation:
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Assignee:
TSUTSUNAKA PURASUCHITSUKU KOGYO KK
International Classes:
B29C33/42; B29C49/42; B29C49/50; B29C51/10; B29C51/30; B29L22/00; (IPC1-7): B29C49/50
Attorney, Agent or Firm:
Hisayoshi Shimizu (2 outside)