Title:
PRODUCTION OF FILMY ADHESIVE
Document Type and Number:
Japanese Patent JP3039126
Kind Code:
B2
Abstract:
PURPOSE: To produce the objective adhesive which is suitable for electrical and electronic uses for which strict reliability is required.
CONSTITUTION: A layer of a solution comprising, as the principal components, an epoxy resin, a resin having functional groups, the molecular weight of which is at least 5000, a mixture of an oxygenic solvent and an aromatic hydrocarbon solvent having a boiling point of 150°C or below and a latent curing agent inactive to the mixture, the water content of the solution being not greater than 2.0%, is formed on a strippable support, and dried at a temperature which is not higher than that at which the curing agent is activated.
Inventors:
Isao Tsukagoshi
Yasushi Goto
Mitsugu Fujinawa
Tomohisa Ota
Yutaka Yamaguchi
Tatsuo Ito
Yasushi Goto
Mitsugu Fujinawa
Tomohisa Ota
Yutaka Yamaguchi
Tatsuo Ito
Application Number:
JP9840792A
Publication Date:
May 08, 2000
Filing Date:
April 20, 1992
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J7/00; C09J163/00; (IPC1-7): C09J7/00
Domestic Patent References:
| JP2102281A |
Attorney, Agent or Firm:
Kunihiko Wakabayashi