Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3056766
Kind Code:
B2
Inventors:
Hiroshi Goto
Application Number:
JP12765890A
Publication Date:
June 26, 2000
Filing Date:
May 17, 1990
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L29/73; H01L21/331; H01L29/165; H01L29/732; H01L29/737; (IPC1-7): H01L21/331; H01L29/165; H01L29/73
Domestic Patent References:
| JP230144A | ||||
| JP62172757A | ||||
| JP1231371A |
Attorney, Agent or Firm:
Keizo Okamoto