PURPOSE: To provide an electronic part soldering method by which connecting strength between an electronic part element and a lead wire can be increased and an electronic part durable to a heat shock can be mass-produced.
CONSTITUTION: In this electronic part soldering method, spare solder quantity being applied to one end part 12a and the other end part 12b of a lead wire 10 can be adjusted in 40-150mg by combining one or two or more processes with each other among the processes to adjust melting solder temperature, to adjust the dipping frequency into molten solder to be plural, to adjust dipping time into the molten solder, to adjust pull-up speed from inside the molten solder and to adjust a crossing angle θ between one end part 12a and the other end part 12b of the lead wire 10.
| JP2001293560 | SOLDERING METHOD |
IWASAKI SHINJI
SATO SETSUO
NAKAMURA OSAMU
