Title:
SEMICONDUCTOR DEVICE AS WELL AS MANUFACTURING METHOD AND ALIGNMENT METHOD THEREOF
Document Type and Number:
Japanese Patent JP3034428
Kind Code:
B2
Abstract:
PURPOSE: To enable an alignment mark to be detected using a stepper by a method wherein the width of the protrusion or recession of an alignment mark is made narrower than the mean particle diameter of the grain of a metallic film on the alignment mark.
CONSTITUTION: An alignment mark XA is made on a dicing line or the periphery of a semiconductor wafer. This alignment mark XA may be a protrusion or a recession formed on a wafer. A metallic film is formed on the alignment mark XA. At this time, the width H from one edge to another edge in the X direction of the alignment mark XA is made smaller than the diameter G of a grain of the metallic film of the alignment mark XA. Through these procedures, the alignment mark XA can be detected using a stepper.
Inventors:
Hiroshi Haraguchi
Masayasu Abe
Wataru Nomura
Masayasu Abe
Wataru Nomura
Application Number:
JP13202094A
Publication Date:
April 17, 2000
Filing Date:
June 14, 1994
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
G03F1/00; G03F9/00; H01L21/027; H01L21/44; H01L23/544; (IPC1-7): H01L21/027; G03F9/00
Domestic Patent References:
| JP3212922A |
Attorney, Agent or Firm:
Takehiko Suzue